Carefully clean the area and inspect the new circuit for proper alignment.
Apply pressure as recommended in the manual of the repair system or repair kit for an additional 30 seconds to fully bond the new circuit. Gently place the bonding tip directly onto the new circuit.Apply pressure as recommended in the manual of the repair system or repair kit for 5 seconds to tack the circuit in place. Gently place the hot bonding tip onto the High Temperature Tape covering the new circuit. Position the circuit board so that it is flat and stable.The bonding tip should be as small as possible but should completely cover the entire width of the new conductor. Select a bonding tip with a shape to match the shape of the new conductor.Leave the tape in place during the bonding cycle. Place the new conductor into position on the circuit board surface using tape to help in alignment. Place a piece of High Temperature Tape tape over the top surface of the new conductor.This gap will minimize the possibility of simultaneous reflow during soldering operations. If the configuration permits, the overlap solder joint connection should be a minimum of 3.00 mm (0.125") from the related termination. Cut the length to provide the maximum allowable circuit overlap for soldering. When handling the new conductor avoid touching the epoxy backing with your fingers or other materials that may contaminate the surface and reduce the bond strength. Scrape off the epoxy backing only from the joint connection area. Before trimming out the new conductor carefully scrape off the adhesive epoxy film from the solder joint connection area on the back of the new conductor.The foil is plated on the top side with solder and an epoxy bonding film is applied to the bottom side.
New conductors are fabricated from copper foil. If a special size or shape is needed it can be custom fabricated.
The damaged circuit should be trimmed back to a point where the circuit still has a good bond to the PC board surface.
It is essential that the board surface be extremely smooth and flat. This method is used to replace damaged or missing circuits on the circuit board surface. To view this video please enable JavaScript, and consider upgrading to a web browser that supports HTML5 video.